Related Party - Equity Joint Ventures	3 Months Ended
Mar. 28, 2026
Equity Method Investments and Joint Ventures [Abstract]
Related Parties - Equity Joint Ventures	Related Party — Equity Joint Ventures ATMP Joint Ventures The Company holds a 15% equity interest in two joint ventures (collectively, the ATMP JV) with affiliates of Tongfu Microelectronics Co., Ltd, a Chinese joint stock company. The Company has no obligation to fund the ATMP JV. The Company accounts for its equity interests in the ATMP JV under the equity method of accounting due to its significant influence over the ATMP JV. The carrying value of the Company’s investment in ATMP JV was $182 million and $176 million as of March 28, 2026 and December 27, 2025, respectively, and is recorded within Other non-current assets on the Company’s Consolidated Balance Sheets. The ATMP JV provides assembly, test, mark and packaging (ATMP) services to the Company. The Company’s purchases from the ATMP JV during the three months ended March 28, 2026 and March 29, 2025 were $718 million and $497 million, respectively. The amounts payable to the ATMP JV were $556 million and $408 million as of March 28, 2026 and December 27, 2025, respectively, and are recorded within Accounts payable on the Company’s Consolidated Balance Sheets. On October 2024, the Company provided a $100 million term loan to one of the ATMP JVs for general corporate purposes. The loan bears interest at the three months term Secured Overnight Financing Rate (SOFR) plus 35 basis points, payable quarterly and matures on October 16, 2026. The loan and related interest receivable are recorded within Prepaid expenses and other current assets on the Company’s Consolidated Balance Sheets. During the three months ended March 28, 2026 and March 29, 2025, the Company recorded income related to the ATMP JV of $6 million and $7 million in Equity income in investee on its Consolidated Statement of Operations, respectively.

Related Party - Equity Joint Ventures

3 Months Ended

Mar. 28, 2026

Equity Method Investments and Joint Ventures [Abstract]

Related Party — Equity Joint Ventures

ATMP Joint Ventures

The Company holds a 15% equity interest in two joint ventures (collectively, the ATMP JV) with affiliates of Tongfu Microelectronics Co., Ltd, a Chinese joint stock company. The Company has no obligation to fund the ATMP JV. The Company accounts for its equity interests in the ATMP JV under the equity method of accounting due to its significant influence over the ATMP JV. The carrying value of the Company’s investment in ATMP JV was $182 million and $176 million as of March 28, 2026 and December 27, 2025, respectively, and is recorded within Other non-current assets on the Company’s Consolidated Balance Sheets.

The ATMP JV provides assembly, test, mark and packaging (ATMP) services to the Company. The Company’s purchases from the ATMP JV during the three months ended March 28, 2026 and March 29, 2025 were $718 million and $497 million, respectively. The amounts payable to the ATMP JV were $556 million and $408 million as of March 28, 2026 and December 27, 2025, respectively, and are recorded within Accounts payable on the Company’s Consolidated Balance Sheets.

On October 2024, the Company provided a $100 million term loan to one of the ATMP JVs for general corporate purposes. The loan bears interest at the three months term Secured Overnight Financing Rate (SOFR) plus 35 basis points, payable quarterly and matures on October 16, 2026. The loan and related interest receivable are recorded within Prepaid expenses and other current assets on the Company’s Consolidated Balance Sheets.

During the three months ended March 28, 2026 and March 29, 2025, the Company recorded income related to the ATMP JV of $6 million and $7 million in Equity income in investee on its Consolidated Statement of Operations, respectively.